3M™ Scotch-Weld™ Hot Melt Adhesive 3797 is a temperature-resistant, low-viscosity adhesive which flows easily into small areas for effective coverage and protection, ideal for electrical potting. This 100% solids thermoplastic adhesive also provides a quick 30-second open bead time for potting even at depth. It is best used with our 3M™ Scotch-Weld™ Hot Melt Applicator PG II and is excellent for high volume operations.Ideal as an electrical potting adhesive and for other applications involving electrical and electronic components, our 3M Scotch-Weld Hot Melt Adhesive 3797 is a 100% solids thermoplastic low melt adhesive that combines low viscosity with high temperature resistance. This makes it ideal for applications where protection and long-term stability are critical. This hot melt adhesive is formulated to flow easily and smoothly into small areas such as those on printed circuit boards and for quick set times - about 30 seconds of open time for effective deep potting and for added efficiency in high-volume jobs. Hot melt adhesives/hot-glue sticks have a relatively hot melting point that ranges between approximately 250-380F/121C, depending on the formulation, and are applied with hot-melt applicators, commonly referred to as hot-glue guns. Hot-melt glues provide a nearly instant bond between many plastics, paper and wood, but when the bond is reheated, some varieties will soften, allowing the bonded surfaces to be separated. The quick-stick nature of hot-melt adhesives speeds up operations in packaging and production.
Details
Industrial Category:
Adhesives, Sealants and Tape
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Substrate:
Plastic, Easy-to-Bond (HSE)
Substrate 1:
Plastic, Easy-to-Bond (HSE)
Substrate 2:
Plastic, Easy-to-Bond (HSE)
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Other Details
30 second bead open time makes for effective potting at depth
allowing for fast-paced production
Ball and ring tested – adhesive exhibits good temperature resistance after application
For use with 3M™ Scotch-Weld™ Hot Melt Applicator PG II
Hot melt adhesive ideal for potting of electrical and electronic components
Low viscosity provides high flow rates for excellent coverage